TU Ilmenau Humbold Bau


Mehrskalen-Modellierung der Mikrostrukturevolution in polykrist. dünnen Kupferfilmen

Bauhaus-Universität Weimar
2016 - 2017
Deutsche Forschungsgemeinschaft
Bewilligungssumme, Auftragssumme
13.250,00 €


The development of microelectronics via a combination of experiment and modeling can reduce the cost of instruments while improving the features. Polycrystalline copper thin films are used in microelectronics in a wide variety of applications. The physical, mechanical, and chemical properties of polycrystalline copper thin films are controlled by their microstructural characteristics. The evolution of grain size and orientation and grain boundary characteristics of copper thin films by abnormal grain growth during the post-deposition annealing process can change their properties and reliability performance. Considering the technical limitations and high costs of the small-scale experiments, the present international collaboration aims to develop a computational model of microstructure evolution in polycrystalline copper thin films during annealing. Particularly, a phenomenological thermodynamically-consistent three-dimensional continuum constitutive theory to describe abnormal grain growth due to grain boundary motion in polycrystalline copper thin films will be developed in a multiscale setting. The constitutive theory will then be numerically implemented into the Abaqus/Standard finite element program using a coupled finite-element and phase-field multiscale numerical algorithm. The developed computational capability will finally be used to quantitatively reproduce the physical experiments of microstructure evolution in polycrystalline copper thin films on polyamide substrate.
Projektsuche | Impressum | FAQ