Projektdaten

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Ultra-Fast Correlative Metrology: Integrating Phase Shifting Interferometry with Scanning Probe Microscopy

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Our goal is to develop a new ultra-fast correlative metrology tool, where phase-shifting· interferometry (PSI) and scanning probe microscopy (SPM) are combined to complement each other. With PSI scanning a large area, SPM performing calibration on several points and matching measurement results simultaneously, fast large-area metrology with sub-nm resolution is achievable. lt is aimed to develop a fast 3D-metrology tool with throughput of 50-60, per hour for 300mm wafers with resolution of 300pm. To achieve this performance, all supporting components of the new system (cantilever, scanners, sensors, hardware and software) are specifically enhanced within the cooperation work by various members. Ultra-Fast Correlative Metrology integrating Phase Shift lnterferometry with Scanning Probe Microscopy (PSISPM) is a unique, newly patented solution that will be both novel and ground-breaking enabling direct 3D viewing used for defect analysis on wafers, thus fundamentally improving process control. Such tools are highly demanded in the semiconductor industry to conduct root cause understanding for troubleshooting yield excursions, since yields of 50- 60% of wafers are reported. In addition, the project will strengthen the cooperation and benefit the EU-Korea countries in advancing products, services and technologies sectors, where speed, scale, precision, traceability and costeffective modern semiconductor metrology solutions can be offered. The planned prototype (TRL6) launch of the PSIS PM system is 2028 and will be addressed to certain segments of the semiconductor industry. After 2028 it is to elaborate marketing & sa.les channels in Europe, North-America and Asia. The companies of Nexensor lnc. and nano analytik GmbH are planning to seil 7-8 instruments (see market chapter) within 2 years after the market entry (2028). The second-source of income will be selling SPM-Probes, interferometers, services and maintenance.